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Re: BGA repair/rework

Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean

| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60

Re: Solder on GF

Electronics Forum | Tue Jul 13 19:00:29 EDT 1999 | JohnW

| Hi All, | Does any one experienced the solder on gold finger after | reflow. Its about 5 to 8 mils diameter . | We'd clean the entire screen printer, mounter & reflow as well, | but doesn't help much. | | Mr Kong..... Solder on gold is a age old

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder

Re: Bottomside smt falling off in wave in only voc-free flux

Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F

| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus

25 mil QFP soldering issue

Electronics Forum | Thu Jul 15 18:07:04 EDT 2004 | dwanzek

This has been a tough one to date. Any ideas will help. Problem definition � random QFP144 part not soldering all leads. Percentage fallout is about 1-5% of boards. Usually leads, one or more, on trailing side to the direction of travel does not wet

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Thu Jan 05 15:09:37 EST 2006 | grantp

Hi, What studies? Can you post a link? I am not sure what the difference is between a ceramic BGA that the high temp solder ball is not expected to collapse, and a lead free solder ball that's run through a lead process and also does not collapse b

Re: ENIG finishing

Electronics Forum | Tue Feb 15 11:48:30 EST 2000 | Steve Thomas

Thanks for your responses, gentlemen. I'm really just looking at options, and frankly, being a novice at this stuff I'm looking for the info. required to make a semi educated decision. You, kind sirs, are my educators. And that probably scares m

Re: Aperture size for Micro BGA stencil

Electronics Forum | Thu Jun 22 12:50:13 EDT 2000 | JAX

Igmar, Although I agree with Chrys that square is good,( Better volumn ) his explanation is not entirely correct. Heres a little insert from automata: With square apertures, solder paste is deposited at the center of the aperture. The center release

Re: CP6 Servo Amp

Electronics Forum | Tue Apr 04 23:01:37 EDT 2000 | Dean

Does Fuji America have a trade in program? I know they used to on vision cards and such. It may be worth your while to get a trade in allowance rather than none at all. The alternative, as you mentioned, is to repair it yourself. This however, w

High Temp (96/4) adhesive cure time/temp

Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman

I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of


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