Electronics Forum | Wed Aug 26 05:24:42 EDT 2009 | ghepo
Ok Eric, finally we know that the problem should be the PILLOW (sincerely, your photo is not very clear) and not the crack of the joint. There is a big difference on the failure mode of the two defects... If the problem is realy a pillow I only ca
Electronics Forum | Fri Oct 02 11:23:08 EDT 2009 | floydf
Does anyone out there have experience soldering > with Pb solder (Sn 63 or Sn 62) to SAC 305 coated > PCB lands (about 50um) or Sn-Cu plated lands > (about 10um). I know soldering Pb free (Sac based > soler) to Pb/Sn coated lands is a no-no, but
Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22
Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Fri Jul 29 06:16:19 EDT 2016 | dmsm123
We do have a commen problem with flux residues after the wave soldering process, even after using correct wave soldering profiles recommended by the flux supplier, The following flux type is being used Alpha EF 2210 VOC Fre Bellcore No Clean water Ba
Electronics Forum | Thu Sep 26 11:53:40 EDT 2019 | scotceltic
Experiencing some solder balls on an SSO-36 package. Things I am planning on checking are as follows: (not necesarilly in this order) I am just looking for a sanity check to see if you would try other things to help ? 1) Reflow profile. I have he
Electronics Forum | Mon Nov 30 14:29:46 EST 2020 | kylehunter
Hi all. A recent board has shown some issues with graping and non-wetting on some 0402 capacitors. I believe we have the issue sorted. A combination of a 4 mil stencil with 2 mil reduction not giving us enough paste, and too long of a soak profile.
Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon
| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U
Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra
RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr
Electronics Forum | Thu Jun 10 15:46:56 EDT 1999 | Chrys Shea
| Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like point-
