Electronics Forum | Wed Aug 13 09:50:32 EDT 2008 | diesel_1t
Hi dave, thanks for your reply I tried to locate "Techni-Tool 872M1034" on the webpage but I found: https://webvia.techni-tool.com/VIA/viaImagePageIndex.jsp?row=3&pgName=viaListProducts.jsp&searchText=CH8C&modifier=CH8C&reqTitle=TITLE_VIAUSERDOCLIST
Electronics Forum | Mon Jan 04 22:59:23 EST 1999 | Kris Ewen
I'd like to add something about the ECD product. During a past work term (I'm a a co-op student) in an SMA plant, I worked extensively with the Super MOLE Gold in developing the reflow profiles for high-mix, low-volume production. I was 'married' t
Electronics Forum | Fri Jun 25 01:11:31 EDT 1999 | Vinesh Gandhi
| | | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody
Electronics Forum | Wed Feb 17 15:56:22 EST 1999 | Tuffty
| Dear Al, | Are these reworked, double-sided boards? | | If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if thi
Electronics Forum | Sun Dec 20 20:40:22 EST 1998 | Miguel Mariscal
I would love to send a copy of my profile thanks, our machine is also a Summit 2000. | | I have developing a BGA Process and having problems with | | 310 IO PBGA reflowing. I am achieving good wetting exept | | 2 to 5 balls on the outer perimeter
Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra
Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t
Electronics Forum | Tue Sep 28 12:58:19 EDT 1999 | Jeff Sanchez
I finaly get a vacation and decide to go to the forum and low and behold it's hot air verses a small ray of sun.I read every thread and still failed to see any real argument either way? I love rework as an assembler. I hate rework as a shop owner. Th
Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
Electronics Forum | Fri Feb 20 20:33:16 EST 1998 | Steve Gregory
The biggest difference between the two, is solder joint appearance. What I noticed mainly is that the solder does not wet and flow as readily to a palladium coated lead as it does with a tin/lead coated lead. When you look at a palladium coated lead
