Used SMT Equipment | Soldering - Reflow
DDM Novastar GF-12HC-HT Gold-Flow SMT Benchtop Reflow Oven appears to be in very nice cosmetic condition. It has NO USAGE, and will be sold *as-is* *where-is*. It powers up, as shown it also responds to input from the controls, and it
Used SMT Equipment | Soldering - Reflow
This Vitronics XPM820A looks to be in excellent cosmetic condition, but does show signs of wear and previous use. This unit comes from a clean warehouse environment XPM-820A S120959
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative / Training Provider
Largest Universal Instruments, Europlacer and Speedprint full service and stocking operation in the industry. Plus many other brands as we install complete turn key SMT lines new and used with full production launch and training.
Used SMT Equipment | Soldering - Reflow
Electrovert Reflow Oven 1995, 440V in, 42kVA. Five (5) zone top, three (3) zone bottom. Just under ten (10) feet long. The oven is fully operational. However, we have to enter the current BIOS settings every time to start the machine because
Used SMT Equipment | Soldering Equipment/Fluxes
I have an older Vitronics Reflow oven which was upgraded in 2005 with windows 2000 c/w Computer and a new controller card. The oven has worked very well with no major issues. It does reach suitable temps for Lead-Free soldering. Pictures can be pr
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
New Equipment | Rework & Repair Equipment
Infrared BGA & SMT Rework at a Price that Can't Be Beat! The IR 1000 is a low-cost, remarkably flexible and effective rework system, capable of installing and removing passives, QFP's, SOIC's, PLCC's, MLF's, LCCC's, TSOP's, QFN's and BGA's. It is id
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
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Used SMT Equipment | Soldering - Reflow
Features 1. Full hot air reflow heat fast, high thermal efficiency compensation, delta t less than ± 2 ℃ soldering is uniform. 2. HELLER company has 40 years of history, process maturity. 3. maintenance costs low, the furnace normal use, electrici
DEFECTS SHALL NOT PASS JUKI SENTRY Guarantees 100% Correctly Assembled Boards. Boards are inspected at each step of the placement process with innovative sensors allowing only correctly assembled boards to enter the reflow oven. The system does not
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