New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Industry Directory | Manufacturer
SURCLEAN is the production consumables division of SMT. SURCLEAN has been established to provide innovative, cost-effective and environmentally safe materials to the electronics industry
ScanINSPECT BGA uses an intuitive process flow interface integrated with a high resolution, 2-D image-processing unit. This combination allows 100% inspection of ball placement on BGAs, in or out of trays (JDEC, etc.). This is Part 1: How to progr
Technical Library | 2024-06-23 22:03:59.0
The melting temperatures of most lead-free solder alloys are somewhat higher than that of eutectic Sn/Pb solder, and many of the alloys tend to wet typical contact pads less readily. This tends to narrow down the fluxing and mass reflow process windows for assembly onto typical organic substrates and may enhance requirements on placement accuracy. Flip chip assembly here poses some unique challenges. The small dimensions provide for particular sensitivities to wetting and solder joint collapse, and underfilling does not reduce the demands on the intermetallic bond strength. Rather, the need to underfill lead to additional concerns in terms of underfill process control and reliability. Relatively little can here be learned from work on regular SMT components, BGAs or CSPs.
Industry News | 2017-08-26 20:24:13.0
BTU International today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.
1, FS innovative patented heating wire heating technology, independent small circulation wind structure, up and down heating, can achieve greater wind capacity, with a high heat exchange rate, can reduce the temperature setting temperature, the heati
Profitable Batch Reflow Oven win7 Operating System T200C+ Product Description: The lead-free reflow oven T200C+ = Reflow oven T200C + temperature curve tester. T200C+ does not only have a lead free welding function, but also has a temperature meas
Industry News | 2018-10-18 10:02:00.0
How does PCB X-Ray Inspection Work?
Eliminate manual periodic profiling KIC Vision² utilizes temperature and speed sensors embedded in the oven for consistent and accurate profile measurements of the processed PCB Programming and Frequencies A single manual profile run wit
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