Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
Industry News | 2022-03-09 12:32:53.0
Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.
Industry News | 2018-04-27 09:51:10.0
BTU International announces that it was awarded three 2018 EM Asia Innovation Awards during NEPCON China. The awards were presented to the company for its PYRAMAX™ Vacuum reflow oven, TrueFlat technology and Profile Guardian during an April 25, 2018 ceremony at the Shanghai World Expo Exhibition & Convention Center in China.
Industry News | 2018-10-18 10:51:08.0
How Conformal Coating Protects PCBs
SN100C P810 D4????????? ???????????? ??????????????????????????????????? ?????????????? ???http://www.nihonsuperior.co.jp/
Industry News | 2018-10-18 09:25:57.0
about wave soldering machine tin pot
New Equipment | Board Handling - Storage
Eureka Dry Tech XDC-501 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://www.eurekadrytech.com/fast-super-dryer/xdc-500 Capacity: 372 Liters Humidity Range: LESS THAN 5% Recovery Time: Recovers to ≤ 5% RH within 30 minutes after acces
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
