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OvenCHECKER™ Reflow Oven Verification Tool

OvenCHECKER™ Reflow Oven Verification Tool

New Equipment | Reflow

Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr

Electronic Controls Design Inc. (ECD)

BTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan

Industry News | 2017-08-26 20:24:13.0

BTU International today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

BTU International

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

BTU Surpasses 50 Industry Awards

Industry News | 2022-07-25 08:28:19.0

BTU International, Inc. today announced that it was awarded two 2022 EM Innovation Awards. The company was awarded in the categories of Soldering – Auxiliary Systems for its Trueflat Technology and Selective Soldering for its Valence 3508 selective soldering system. With these two awards, the company marks 51 industry awards for its thermal processing equipment.

BTU International

SN100C P810 D4 low-voiding lead-free solder paste.

SN100C P810 D4 low-voiding lead-free solder paste.

Videos

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Nihon Superior Co., Ltd.

Indium Corporation Introduces Liquid Flip-Chip Flux

Industry News | 2022-03-09 12:32:53.0

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.

Indium Corporation

McDry Ultra-Low Humidity Storage Cabinets

McDry Ultra-Low Humidity Storage Cabinets

New Equipment | Board Handling - Storage

Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack

Seika Machinery, Inc.

BTU Picks Up Three EM Asia Innovation Awards at NEPCON China

Industry News | 2018-04-27 09:51:10.0

BTU International announces that it was awarded three 2018 EM Asia Innovation Awards during NEPCON China. The awards were presented to the company for its PYRAMAX™ Vacuum reflow oven, TrueFlat technology and Profile Guardian during an April 25, 2018 ceremony at the Shanghai World Expo Exhibition & Convention Center in China.

BTU International

PACE ST 325 Digital, Programmable Hot Air Reflow System

PACE ST 325 Digital, Programmable Hot Air Reflow System

New Equipment | Rework & Repair Equipment

Convective SMT Rework System is Fully Programmable The ST 325 is a digital, self-contained system that is fully programmable and can be used to remove or install surface mount components when individual or multiple operations are to be run. From the

PACE Worldwide

ScanINSPECT SPI - Solder Paste Inspection Station

ScanINSPECT SPI - Solder Paste Inspection Station

New Equipment | Inspection

ScanINSPECT SPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT SPI uses a simple Windows user interface integrated with an automatic conveyo

ScanCAD International, Inc.


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