Full Site - : does 2216 bond (Page 9 of 23)

Silicone for bonding?

Electronics Forum | Wed Oct 01 15:45:35 EDT 2003 | Jalinous Esfandayri

Hi Everyone: Does anyone know what the right silicone for bonding the pressure sensor bare die on PCB is? How do I prevent the fracture and keep good adhesive? Any help would greatly be appreciated. Regards, Jalinous Esfandyari Intelligent

Plating for aluminum wire bonding

Electronics Forum | Sat Mar 15 20:24:13 EST 2003 | ramanandkini

Thanks Mr.Dave. Sorry for the delay. One of our major prolems in ENIG plated surface is that wire does not stick. For many years we were getting a bond strength of 14 grams in both ENIG and electroplated surfaces. Now one vendor supplies ENIG boards

Die bonded at an angle in a QFN component

Electronics Forum | Wed Jul 29 14:55:41 EDT 2020 | philc

Maybe check with the manufacturer? I am sure they would know if this was normal. And does the PCB function as expected? If it does, maybe not an issue....

Vapor Phase Ovens

Electronics Forum | Wed Feb 14 14:17:41 EST 2001 | Glenn

Does anyone know of any vapor phase oven manufacturers? The application requires bonding a 3-D object at various joint surfaces using eutectic solder. The vapor zone shall require approximately 10 inches of height. The available SMT vapor phase ov

ACF Process

Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon

Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and

How actually the process of Electrofoam Stencil?

Electronics Forum | Fri Jan 07 03:04:12 EST 2005 | Deepak Mudliar

Following are my queries : 1. How actually the process of electrofoam Stencil preparation? 2. How N2 Helps for Leadfree soldering ? 3. Does Ultrasonic Cleaning process affects the internal bonding of IC ?

SMT Glue

Electronics Forum | Tue Oct 24 17:31:57 EDT 2006 | SWAG

We have a SMT part that has been adhered to a board using Loctite 3609. I can't find anything in the product specs. on how to release the bond to remove the part. Does anyone know?

sri repairs pad repairs

Electronics Forum | Tue May 19 03:19:33 EDT 2009 | cunningham

Has anyone used a hot press to bond new pads to the boards if they have been lifted? we have one and have tried and carried out some DOE's on FR4 boards but when trying the same settings on Polyamide they basically fell of can anyone give any pointe

Testing for hard gold

Electronics Forum | Wed Jul 31 13:19:38 EDT 2013 | anvil1021

Does anyone know how to test for hard gold on a PCB? We are in a challenging situation with a PCB provider and we need some objective evidence other than wire bond failure to present to them. Any comments could help ....Thank you Anvil

Re: Reliability of coated Plastic encapsulated Microcircuits

Electronics Forum | Wed Jul 22 16:00:24 EDT 1998 | David A. Pinsky

| Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? We have performed failure analyses on PEM's in our lab for many years. The vast majority of pa


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