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Non-contact Jet Valve from PVA at SMTA Ohio Expo

Industry News | 2019-07-16 19:49:23.0

PVA will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, Aug. 8, 2019 at the Holiday Inn Cleveland Strongsville. Company representatives will highlight the SJ100 non-contact jet valve for selectively applying conformal coatings onto substrates with close keep-out tolerances.

Precision Valve & Automation (PVA)

Indium Corporation's Proven Jetting Paste Recommended by NSWAutomation

Industry News | 2020-12-03 13:07:26.0

Indium Corporation's newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSWAutomation for use with their newest microfluid dispenser, SD1.

Indium Corporation

ESSEMTEC to Exhibit Its Scorpion in America for the First Time at the IPC APEX EXPO

Industry News | 2013-01-14 14:43:06.0

Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO

ESSEMTEC AG

Techcon Systems Introduces New Non-Contact Jetting Technology

Industry News | 2012-11-12 18:39:38.0

Techcon Systems,, introduces the new TS9000 Series Jet Tech valve for the Asian and European markets.

Techcon Systems

Davlec Increases Production Capacity with Essemtec’s Paraquda System

Industry News | 2013-09-05 15:55:40.0

Essemtec’s high-speed Paraquda SMT pick-and-place system has recently been selected by Davlec Ltd, an electronics company based in Wales, specialising in the design and manufacture of control equipment for the dairy farming industry.

ESSEMTEC AG

DEK�s ProFlow� DirEKt Imaging technology wins prestigious industry manufacturing award

Industry News | 2006-04-17 18:17:31.0

DEK has won another prestigious industry award for its revolutionary ProFlow� DirEKt Imaging technology. At the Nepcon China 2006 exhibition in Shanghai, China, DEK will receive the award for best entry in the Dispensing Systems/Equipment category at the Electronics Manufacturing Asia Innovation Awards 2006.

ASM Assembly Systems (DEK)

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

Essemtec to Define a New Standard - Paraquda is the world’s most advanced pick-and-place machine

Industry News | 2009-11-11 13:39:57.0

Paraquda is the newest SMD pick-and-place machine that Essemtec has introduced at the Productronica exhibition in Munich, Germany. The machine sets a new standard for flexible placement machines: Drive technologies, materials and software are state-of-the-art, machine operation is a user friendly and the application range is wider than ever before.

ESSEMTEC AG

Essemtec to Show the Latest Innovation for Solder Jet Printing at SMTAI

Industry News | 2021-10-07 15:33:28.0

Essemtec will exhibit at the the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company will highlight its dispensing solution for both the electronics and medical industries in Booth #3520.

ESSEMTEC AG

SCS Introduces the Precisioncoat V Conformal Coating System

Industry News | 2015-01-27 12:08:05.0

Specialty Coating Systems (SCS) introduces its new Precisioncoat V conformal coating system. The Precisioncoat V, available in conformal coating, dispensing and/or potting platforms, offers maximum flexibility and efficiency for manufacturers.

Specialty Coating Systems


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