Industry News | 2009-08-07 19:24:15.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2013-10-21 16:05:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas.
Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: Backup Pin Part Number: J7500003B Color: Black Material: Plastic Nature: Magnetic Usage: Samsung CP45NEO CP45FV SM421 Machine Backup Pin J7500003B For CP45FV NEO/SM421/411/321 Machine PCB Suport Pin Des
Industry News | 2009-11-06 17:10:00.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the the 6th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success. The IWLPC was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California.
Industry News | 2010-06-21 15:29:58.0
BANNOCKBURN, IL — Environmental regulations on chemicals and substances continue to grow worldwide, often driven by political pressures. While some focus on manufacturing wastes, such as air and wastewater emissions, there is a growing lexicon of regulations which focus on the chemicals contained in products. To help companies understand new laws, regulations and regulatory trends, IPC will hold an IPC Symposium on Electronics and the Environment on July 19–21, 2010, in Boston, Mass.
Industry News | 2011-01-20 13:54:40.0
IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.
Industry News | 2011-07-27 22:32:31.0
IPC will host the IPC Executive Summit, “Succeeding in a Disruptive Environment: From Earthquakes to Nanoparticles,” on October 4-5, 2011, in San Jose, Calif.
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
