Industry Directory | Consultant / Service Provider / Manufacturer
SemiPack Services is an Electronic Manufacturing Support Service to the semiconductor industry. We specialize in providing support services to high-mix low-volume (HMLV) customers
Industry Directory | Manufacturer
Arizona ProCoat leads the industry in precision painting, conformal coating, potting and bonding
New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Electronics Forum | Wed Feb 12 02:38:02 EST 2020 | majdi4
Hi there , I agree with phil .. but we cannot change the architecture of the card to mount the connector on the 2nd side. Steve , we are producing large series, so we can't manually ship bond the connector .. for the moment, we cannot invest in a gl
Electronics Forum | Thu Sep 08 07:04:02 EDT 2005 | davef
Finer pitch: Wedge bonding can be designed and manufactured to very small dimensions, down to 50 mm pitch. Processing speed: Machine rotational movements make the overall speed of the wedge bonding process less than thermosonic ball bonding. Alumin
Used SMT Equipment | In-Circuit Testers
JDSU DSAM-6300 DSAM-6300 Network Maintenance Sweep Meter with DOCSIS / EuroDOCSIS Capabilities. Combines triple-play services testing, forward and return path maintenance, and Stealth Sweep Technology to deliver award-winning performance. The DS
Used SMT Equipment | SMT Equipment
ADBHF8060 QP351E-OF SAM6580 SERVO MOTOR SGMAH-A5A1A4C (AC,50W,Multi Phase) MTU9E(TY) SAM6590 SERVO MOTOR SGMAH-04A1A4C (AC,400W,Multi Phase) MTU9E(TZ) SAM6600 SERVO MOTOR SGMM-A1C3FJ14 (AC,10W,Multi Phase) QP341E/NP1(Q) POWER SUPPLY P/N:T4195E D
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Parts & Supplies | SMT Equipment
UNIVERSAL Series No. P/N description 201 17190000 RAIL, CAM 202 17191000 SHAFT 203 17195003 DRIVER TIP-RH 204 17195004 DRIVER TIP-RH 205 17196003 DRIVER TIP-LH 206 17196004 DRIVER TIP-LH 207 17197007 FORMER-RH STD 208 171980
Parts & Supplies | SMT Equipment
UNIVERSAL Series No. P/N description 201 17190000 RAIL, CAM 202 17191000 SHAFT 203 17195003 DRIVER TIP-RH 204 17195004 DRIVER TIP-RH 205 17196003 DRIVER TIP-LH 206 17196004 DRIVER TIP-LH 207 17197007 FORMER-RH STD 208 171980
Technical Library | 2024-06-23 22:03:59.0
The melting temperatures of most lead-free solder alloys are somewhat higher than that of eutectic Sn/Pb solder, and many of the alloys tend to wet typical contact pads less readily. This tends to narrow down the fluxing and mass reflow process windows for assembly onto typical organic substrates and may enhance requirements on placement accuracy. Flip chip assembly here poses some unique challenges. The small dimensions provide for particular sensitivities to wetting and solder joint collapse, and underfilling does not reduce the demands on the intermetallic bond strength. Rather, the need to underfill lead to additional concerns in terms of underfill process control and reliability. Relatively little can here be learned from work on regular SMT components, BGAs or CSPs.
Technical Library | 2014-10-30 01:48:43.0
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed
This video demonstrated the use of BEST Inc HotDots(TM) which allow wires to be affixed to the PCB or other surfaces-even when those surfaces go through reflow. There are other similar products out there but none of which can be readily customized no
Flip Chip Thermosonic Bonding with the FINEPLACER® pico MA. http://eu.finetech.de/micro-assembly/products/fineplacerr-pico-ma.html More information about Thermosonic bonding: http://eu.finetech.de/micro-assembly/technologies/ultrasonic-thermosonic-b
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | IPC-7711/7721 Specialist (CIS)
The Certified IPC-7711/7721 Specialist (CIS) training focuses on rework of electronic assemblies and repair and modification of printed boards and electronic assemblies.
Career Center | ORLANDO, Florida USA | Engineering,Maintenance,Production,Technical Support
Manufacturing tech/eng for a contract manufacture for 10+ years. Been working in the SMT industry for a total of 20yrs. Have done everything from operator to process work. Most familiar with Assembleon, MPM, DEK, BTU,Electrovert, SLIM-KIC, SUPER-MOLE
Career Center | Bangalore, Karnataka India | Engineering,Production,Research and Development,Technical Support
� Exposure to Siemens Pick & Place M/Cs. � Basic knowledge in POP components, 01005 component package. � Exposure in SIX SIGMA TOOLS � WHITE BELT. � Performing DFM for the new products & running products. � Exposure in scre
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc Title: Wire Bonding
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
PCBA Cleaning Machine / PCB Defluxing -For Best Coating and Bonding Effect - I.C.T SMT Machine English Bahasa indonesia Сербия Česky Dansk Deutsch
Heller Industries Inc. | https://hellerindustries.com/curing-oven/
520 Pressure Curing Oven (PCO) Home » 520 Pressure Curing Oven (PCO) 520 Pressure Curing Oven A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications
winsouce.jpg)