Electronics Forum: dpak void (8)

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

Aperture shape for DPAK

Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh

Windowpane your ground planes, this will prevent a lot of voiding.

Industry News: dpak void (3)

Indium Corporation Names Silver Quill Award Winners

Industry News | 2019-01-16 20:44:36.0

Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.

Indium Corporation

Indium Corporation Experts to Present at IPC APEX Expo

Industry News | 2019-01-08 20:28:27.0

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.

Indium Corporation

Express Newsletter: dpak void (106)


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