Industry News | 2019-01-16 20:44:36.0
Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.
Industry News | 2019-01-08 20:28:27.0
Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.
Industry News | 2021-06-17 15:18:27.0
Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh
Windowpane your ground planes, this will prevent a lot of voiding.
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Fri Dec 03 13:29:39 EST 2004 | cyber_wolf
Voids are quite common. You just need to make sure that it is not excessive per your assembly criteria. Take a look at a D-pak under X-ray.
Electronics Forum | Mon Aug 18 17:15:15 EDT 2008 | jlawson
This can be seen on leaded soldering also as well as LF (worse with LF). To reduce this you can look at your stencil and profile. Printing a cross-hatch deposit can reduce the voiding as it allow gasses to release when in reflow - thats the theory
Electronics Forum | Thu May 03 17:33:20 EDT 2018 | dleeper
Solder paste selection can have a huge impact on size and quantity of voids. Talk to a few suppliers and ask for their recommendation on low voiding formulas. Pick a few of your top candidates and then perform a DOE to see who has the best result. S