Electronics Forum | Mon Sep 23 02:54:40 EDT 2013 | pradeep_selec
We are using Dpak package & I would like to know which is the best Aperture shape for DPAK, whether is there any problem if the Aperture of Ground pad is made of the same shape & size as the pad & what are the possible issues faced with it. Can I hav
Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef
We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet
Electronics Forum | Thu Jun 05 00:00:09 EDT 2003 | Jacky
Hi, Can anyone tell me where I can get heatsinks for DPAK devices? It will be used for cooling IGBTs. Preferably, the heatsink device should be soldered for easy production. Thanks alot.
Electronics Forum | Thu Jun 05 15:34:16 EDT 2003 | davef
Heatsink DPAK SMT Tin Plated: Wakefield Part Number: 21736CT We have no relationship nor receive benefit from the company referenced above. Look here: http://www.heatsink-guide.com/links.htm
Electronics Forum | Mon Jun 01 05:23:40 EDT 2009 | kircchoffs
hi manuel, you can try vision 180 frontlight. treat DPAK as two leaded part. assign the the upper and lower leads at 1 and 3.
Electronics Forum | Mon Jul 29 13:48:20 EDT 2013 | cyber_wolf
We have placed millions of DPAKS on our Mydatas without issues. Usually the crosshairs need to be just slightly to the right of the dimple when trimming. We do not use high centering force. Please tell us exactly what the error message is.
Electronics Forum | Sun Apr 19 11:19:52 EDT 2020 | davef
A-610G 7.5.16 Components with Bottom Thermal Plane Terminations (D-Pak) says: 100% wetting to land in the end-joint contact area. Is that what you're asking about? Regards, David Fish [davef] Technical Editor & Customer Advocate
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Electronics Forum | Fri Nov 17 15:04:59 EST 2006 | ehess
WE have a problem with a DPAK component floating during reflow, causing it to move to the point where it affects the toe fillet. We have been using a dot of SMT epoxy to hold it secure for the moment. I have looked on many sites, but no whrere can