New Equipment | Assembly Services
Molex New and Original 53375-1010 in Stock IC Connectors package 53375-1010 Wire-to-Board/Wire-to-Wire Connectors AD7685CRMZRL7 MSOP-10 ADI 22+ AT21CS01-MSHM10-T XFSN MICROCHIP 18+ ADG508ATQ CDIP
New Equipment | Assembly Services
ADI New and Original AD9528BCPZ in Stock IC 72-VFQFN package AD9528BCPZ JESD204B Clock Generator with 14 LVDS/HSTL Outputs AD7685CRMZRL7 MSOP-10 ADI 22+ AT21CS01-MSHM10-T XFSN MICROCHIP 18+ ADG508ATQ
New Equipment | Assembly Services
TI New and Original CC2640R2FRHBT in Stock IC 32-VFQFN package CC2640R2FRHBT SimpleLink™ 32-bit Arm Cortex-M3 Bluetooth® Low Energy Wireless MCU with 128kB Flash and 275kB ROM AD7685CRMZRL7 MSOP-10 ADI 22+ AT21CS01-MSHM
New Equipment | Assembly Services
Maxim Integrated New and Original MAX3295AUT+ in Stock IC SOT23 package MAX3295AUT+ 6 Pin MAX3295 Receivers1 Bits 1/0 Drivers/Receivers1 Functions AD7685CRMZRL7 MSOP-10 ADI 22+ AT21CS01-MSHM10-T XFSN MICROCHIP
Industry News | 2003-06-11 13:44:10.0
Research conducted by Siliconix indicates their newly released devices offer the best performance of any power MOSFETs in a thermally enhanced package.
TI New and Original LM2576HVSX-ADJ/NOPB in Stock IC SOT263 21+ package LM2576HVSX-ADJ/NOPB Step-Down Switching Regulator IC Positive Adjustable 1.23V 1 Output 3A TO-263-6, D²Pak (5 Leads + Tabs), TO-263BA AD7731BRUZ-REEL7 TSSOP-24 TSSOP-24 22+
Electronics Forum | Wed Jun 15 08:45:25 EDT 2011 | edmaya33
check your reflow chain. it maybe vibrating causing DPAK to fall at second reflow.
Electronics Forum | Thu Aug 13 16:25:11 EDT 2015 | emeto
Loctite 3609. Just a small dot under the D-Pak and it works 100%.
Electronics Forum | Mon Sep 23 02:54:40 EDT 2013 | pradeep_selec
We are using Dpak package & I would like to know which is the best Aperture shape for DPAK, whether is there any problem if the Aperture of Ground pad is made of the same shape & size as the pad & what are the possible issues faced with it. Can I hav
Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef
We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet
