Electronics Forum | Fri Apr 18 18:11:38 EDT 2003 | slthomas
"glue the floater in place with chip bonder before reflow" gets my vote. We have decals for DPAKs and TO-252's that don't match either specification, and chip bonder is the only answer if they won't spin the board for you.
Electronics Forum | Fri Dec 03 13:29:39 EST 2004 | cyber_wolf
Voids are quite common. You just need to make sure that it is not excessive per your assembly criteria. Take a look at a D-pak under X-ray.
Electronics Forum | Thu Jan 15 21:16:18 EST 2009 | davef
Our first impulse would be to blame someone else. We'd send some of the DPAK from inventory to: * Supplier * Outside failure analysis laboratory ... for delidding and analysis
Electronics Forum | Tue May 26 11:56:30 EDT 2009 | mmjm_1099
I also use Flexa but we use QP3 and our vision number is 20. I would feel they are comparable libriares.
Electronics Forum | Wed Jun 15 10:30:18 EDT 2011 | SBecmpe
If you have the ability to control top and bottom zone temperatures verify that the difference in your peak area is 10 to 20 degrees. This will depend on the ovens capabilities.
Electronics Forum | Mon Jul 29 09:43:31 EDT 2013 | cyber_wolf
First figure out which centering phase it is using when the part gets rejected. Then run the machine in step mode and watch whats going on.
Electronics Forum | Mon Jul 29 11:17:45 EDT 2013 | kjs123p
Is it failing the optical measurement or a vac measurement? I know that sometimes there is a dimple on the face which can cause rejects due to low vac. I am not sure about the MyData though.
Electronics Forum | Tue Jul 30 11:58:50 EDT 2013 | gnus
Seems to pick up and place fine now. No idea why, didn't change a thing. Thanks for the advice everyone!
Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto
Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa
Electronics Forum | Fri Oct 11 16:25:43 EDT 2013 | scdunlap
Also coplanarity can be poor on these parts so overprinting the paste (beyond the pad perimeter) can increase volume to insure robust solder joint.
