Electronics Forum | Wed Aug 26 07:00:16 EDT 1998 | Wayne Bracy
| I am looking for advice on feeders for the MPAV Panasonic machine. We are about to encounter our first experience with Panasonic. We are unsure of which style feeders to buy for tube parts. Parts mix includes all sizes of D-paks, SOICs, PLCCs and
Electronics Forum | Thu Mar 21 21:21:37 EST 2002 | davef
In the beginning, there was TO-5. And it was good. Flushed with success, they created TO-220. It too was good. Then came SMT. It was better than some things, but then again ... In these early days, there was a haze on the horizon that blocked t
Electronics Forum | Fri Mar 22 10:55:11 EST 2002 | slthomas
Dave, you are THE master of the search. I made the lame assumption that if they'd had layout specs. for a part, it would be part of the spec. Bad assumption. The layout for the decal from that page you linked to is exactly what I needed. I look
Electronics Forum | Fri Mar 29 10:51:20 EST 2002 | lsmith
The IPC-EM-782 reads as follows: the adjustment factor is usually intended to increase the Z dimension slightly, but brings the Z maximum up to an even equivalent. Example if Zmax is 2.100mm then you would enter an adjustment factor of .100mm. The ad
Electronics Forum | Fri Mar 29 11:32:37 EST 2002 | slthomas
Thanks, Larry, more good info. I think my designer has that spec. in his library. What we DID find that while we had the proper pattern called out in our in house spec. sheet for the part, the designers don't look at the spec. sheets. They just grab
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Mon Jul 22 09:02:25 EDT 2002 | xrayhipp
Rob is right on it. The best is when Manufacturing has developed a solid process for a particular build using set component packaging; then, when that build hits the floor later that year for a second run etc.. all odd-forms are in different package
Electronics Forum | Fri Jan 28 09:30:07 EST 2005 | reash
Well the powers that be actually want to go with a regular rework station, for future growth. I guess they plan on using BGAs sometime in the near future. We're also planning on using a D-Pak device in this first board. So now we're looking at the
Electronics Forum | Fri Jun 03 15:18:04 EDT 2005 | mmjm_1099
Hello, I was wondering about specs on SMT stencil ordering. I am looking to make some sort of template for aperature layout of some parts. I was wondering some issues that you have all came across or made to change to better suit your boards. For ins
Electronics Forum | Fri Jan 12 19:49:07 EST 2007 | stepheniii
I think she might be more on track about the air flow. I would think they not only have thermal mass but also emit thermal energy well which would add to the dificutly of removing them. I think a Dpak would have more local thermal mass than the shie
