Electronics Forum | Fri Mar 29 11:32:37 EST 2002 | slthomas
Thanks, Larry, more good info. I think my designer has that spec. in his library. What we DID find that while we had the proper pattern called out in our in house spec. sheet for the part, the designers don't look at the spec. sheets. They just grab
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Mon Jul 22 09:02:25 EDT 2002 | xrayhipp
Rob is right on it. The best is when Manufacturing has developed a solid process for a particular build using set component packaging; then, when that build hits the floor later that year for a second run etc.. all odd-forms are in different package
Electronics Forum | Fri Jan 28 09:30:07 EST 2005 | reash
Well the powers that be actually want to go with a regular rework station, for future growth. I guess they plan on using BGAs sometime in the near future. We're also planning on using a D-Pak device in this first board. So now we're looking at the
Electronics Forum | Fri Jun 03 15:18:04 EDT 2005 | mmjm_1099
Hello, I was wondering about specs on SMT stencil ordering. I am looking to make some sort of template for aperature layout of some parts. I was wondering some issues that you have all came across or made to change to better suit your boards. For ins
Electronics Forum | Fri Jan 12 19:49:07 EST 2007 | stepheniii
I think she might be more on track about the air flow. I would think they not only have thermal mass but also emit thermal energy well which would add to the dificutly of removing them. I think a Dpak would have more local thermal mass than the shie
Electronics Forum | Thu Jan 18 15:28:10 EST 2007 | CK the Flip
If you are, in fact, running a No-Clean solder paste: Different no-clean solder pastes will leave different types of (benign) residues. If your paste has been qualified from a Bellcore/SIR/Electromigration standpoint, any residues remaining will NO
Electronics Forum | Tue Mar 06 19:45:52 EST 2007 | davef
DPAK align on the tab with leaded solders. They don't align much with unleaded solders, but we know that your Indium NC-SMQ 92J is leaded. So, there may be too much paste on the heat sink tab causing the component to float [or wim] during reflow. If
Electronics Forum | Thu Mar 08 14:30:45 EST 2007 | ratsalad
If you are in the middle of a run and can't get a replacement stencil there immediately, you can always put a little kapton tape on the bottom of the stencil to mask off a portion of the DPAK pad and reduce the paste deposit. We have had to do this
Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno
We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with
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