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High-density multilayer PCBs for Wireless LAN Card

High-density multilayer PCBs for Wireless LAN Card

New Equipment |  

Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold

Ludee Circuits

High-density multilayer PCBs for Wireless LAN Card

High-density multilayer PCBs for Wireless LAN Card

New Equipment |  

Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold

Ludee Circuits

A-Laser Cutting Services

A-Laser Cutting Services

New Equipment | Depaneling

A-Laser's services focus on four forms of laser ablation: routing, drilling, skiving, and depanelling. Diode pumped frequency tripled NdYag lasers +/- .0005" tolerances 50+ years experience engineering support Ultra thin metals a

FCT ASSEMBLY, INC.

PCB Laser Services

PCB Laser Services

New Equipment | Depaneling

MLT provides rigid and flexible circuit laser services including laser routing (excising), cavity skiving, coverlay/coverfilm routing, microvia drilling, ZIF Contours, Kapton window skives, depaneling, and marking. With 20 years experience, MLT has

Micron Laser Technology

Panasonic NPM Flow Sensor PFMV530F-1-N-X921 N510054834AA

Panasonic NPM Flow Sensor PFMV530F-1-N-X921 N510054834AA

Parts & Supplies | Assembly Accessories

Line Camera Jig N610071657AA JIG-NOZZLE N610003301AA CASE N210113454AA JIG SET N610112815AA Mount Height Teach Jig N610003319AA CASE N210155399AA Head Stand(2Head):NPM-W N610124224AB PLATE N210147290AB PLATE N210147291AB COVER N2101

ZK Electronic Technology Co., Limited

ScanCAD offers a family of modular products to assist in the PCB Reverse Engineering Process. Start from a PCB or set of films to generate all the needed data and files (from BOM to Schematic) to manufacture or repair legacy parts.

ScanCAD offers a family of modular products to assist in the PCB Reverse Engineering Process. Start from a PCB or set of films to generate all the needed data and files (from BOM to Schematic) to manufacture or repair legacy parts.

Videos

ScanCAD offers a family of modular products to assist in the PCB Reverse Engineering Process. Start from a PCB or set of films to generate all the needed data and files (from BOM to Schematic) to manufacture or repair legacy parts. Precise form, fi

ScanCAD International, Inc.

High Temperature Ceramic Capacitors for Deep Well Applications

Technical Library | 2015-01-22 17:32:27.0

Temperature requirements for ceramic capacitors have increased significantly with recent advances in deep-well drilling technology. Increasing demand for oil and natural gas has driven the technology to deeper and deeper deposits resulting in extreme temperature environments up to 200°C and above. A novel capacitor solution utilizing temperature-stable base-metal electrode capacitors in a molded and leaded package addresses the growing market high temperature demands of (1) capacitance stability, (2) long service life, and (3) mechanical durability. A range of high temperature C0G capacitors capable of meeting this 200°C and above high temperature environment has been developed. This paper will review the electrical, reliability, and mechanical performance of this new capacitor solution

KEMET Electronics Corporation

How can you tell the differences between revisions of the same board?

Technical Library | 2016-11-08 16:47:18.0

Over time most PCB designs need to change – a mistake is found, or a part becomes obsolete, etc. Typically once the changes are complete, a new set of manufacturing files (Gerbers, NC Drill files, BOM, Pick and Place, etc) are generated, and the updated design is stored as separate version within a version control system. Using a version control system makes it possible for design teams to go back later and compare differences between design versions. ****** http://www.numericalinnovations.com/blogs/news/gerber-comparisons-between-revisions-of-the-same-board *****

Numerical Innovations

Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle

Technical Library | 2019-05-15 22:26:02.0

As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur.

Cisco Systems, Inc.

Custom Test Fixtures

Custom Test Fixtures

Videos

Intrinsic Quality is pleased to offer a variety of Test Fixture Development Services that include fixture building, tester interface building, harness building, troubleshooting, maintenance, design, and engineering. IQ’s fixtures are built to exactin

Intrinsic Quality LLC


drilling searches for Companies, Equipment, Machines, Suppliers & Information

Thermal Interface Material Dispensing

High Resolution Fast Speed Industrial Cameras.
Selective Soldering Nozzles

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Voidless Reflow Soldering

High Throughput Reflow Oven
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications


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