Electronics Forum | Wed May 09 15:15:52 EDT 2001 | caldon
Your process needs some refining. How long did it take to wet? How much force did it take to break the surface tension? What type of solder was in the solder pot? What type of flux was used? What was the pot temperature? Did you take a cap and p
Electronics Forum | Wed Sep 12 14:08:37 EDT 2001 | caldon
PLEASE!!!! If that were the case then a 6 mil stencil is not a 6 mil stencil depending on paste, pressure, snap off...... We have and use the LSM 300 paste inspection to great degree of success (esp. for solder paste on semiconductor devices). So w
Electronics Forum | Thu Jun 21 11:58:15 EDT 2001 | caldon
The data for this is overwhelming. My best advice would be to contact our lead-free specialists Lee Whitemann or Blaine Partee. Blaine's email is bpartee@aciusa.org Phone 610-362-1200 x 209. Lee's email is lwhitemann@aciusa.org Phone 610-362-1200 x
Electronics Forum | Thu Jul 05 11:14:04 EDT 2001 | caldon
We can offer two ways. We have a process control tool for OSP boards to validate the finish......but the dates yer talking may be best to take Daves F suggestion. NOW as far as the HASL finish goes...We may have your answer. We can Chemically revers
Electronics Forum | Thu Jul 12 16:18:24 EDT 2001 | caldon
I am not familiar with the ERSA system you talk about but wanted to let you know there is another company call PDR that also uses IR and no nozzles. the machine is pretty slick and easy to use and set up. We have found no adverse affects to the IR he
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Tue Aug 21 08:44:48 EDT 2001 | caldon
A) The standoff height of some uBGA components does not allow water to penatrate under the component. B)Water soluable may dilute the flux and not remove it all together. This can be tested with Ion Chromatography. C) Water soluable in some cases ne
Electronics Forum | Tue Sep 04 09:12:35 EDT 2001 | caldon
Moisture would be my main concern. Even though components are plastic, they can absorb moisture. Moisture is also detrimental to the the solder itself. The water droplets that are left behind (evaporated even) could cause problems (i.e. chlorides).
Electronics Forum | Fri Sep 07 07:39:11 EDT 2001 | caldon
Can you confirm the components are being picked up from the feeders? If the Feeder table calibration is incorrect the components could be picked up off from the begining. This would result in 1) nozzle barely picking up the part and as the head moves
Electronics Forum | Tue Dec 11 23:44:32 EST 2001 | caldon
Dave- Have I got the protype machine for you! Contact me off line at cdriscoll@manncorp.com Also, You gots-ta have a local assembler near you to help with this. What college are you attending? I know for a fact ACI in Philadelphia have assisted many
