Industry News | 2021-12-09 08:41:38.0
CES 2022: Joint Presentation of Optical In-vehicle Network Solution for Autonomous Vehicles
Industry News | 2019-08-16 15:34:11.0
Michigan Based Manufacturer’s Rep Added to Channel First™ Program
Industry News | 2013-10-02 13:27:19.0
NEPCON South China, which took place at the Shenzhen Convention and Exhibition Center in August, is the largest, longest running electronics trade fair in South China.
New Equipment | Solder Materials
MS2 Solder Dross Eliminator doesn’t just reduce solder dross associated with wave soldering machines – it actually eliminates it, whether you are working with leaded solder or lead-free alloys. MS2 molten solder surfactant works with your evolving
Portable filter unit w/ flexible exhaust arm or hood to reduce dross dust exposure during dedrossing of wave solder units.
New Equipment | Solder Materials
The Solder-Saver, from Aprotec: offers the opportunity to instantly recyle dross created in the solder pot. Hot dross is scooped up from the surface of the wave solder pot by the hand held, lightweight Solder-Saver. The unit separates dross oxides
Industry Directory | Consultant / Service Provider / Manufacturer
World Leaders in Solder Recovery.
Industry Directory | Consultant / Service Provider / Manufacturer
1. SMT machine manufacturer over 14 years 2. AOI automated optical inspection system(offline/online/customized models),SPI 3. pick and place, reflow oven, DIP wave, solder dross separation machine 4. buffer, conveyor, other SMT
Industry News | 2021-10-11 16:06:46.0
KIC will exhibit in Hall A2, Stand 316 at productronica, scheduled to take place 16-19 November 2021 at the Messe München in Germany. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
