Industry News | 2017-09-13 14:24:45.0
Engineered Material Systems is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.
New Equipment | Rework & Repair Equipment
The BEST PCB throughole repair kit gives you the tools you need for fast modification and repair of PCB plated throughhole pads and barrels-no matter what their size. Our online PCB repair training videos, our master instructors along with these mate
Industry News | 2018-03-08 18:44:09.0
Engineered Material Systems is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2014-05-05 16:29:24.0
Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).
The All New Automated Optical Inspection of Bare Board, Flex Circuit, Art Work and Dry Film. ViTrox V2000 AOI is a fast, accurate, cost effective machine that guarantees the production quality. With the integration and partnering with PCB-Investiga
New Equipment | Coating Materials
Parylene conformal coatings play a critical role in protecting today's electronic components. And as electronic packages continue to become smaller and more complex, we will continue to deliver ultra-thin and pinhole-free electronics coatings that me
Industry News | 2015-06-17 14:45:34.0
Engineered Material Systems is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2017-03-20 17:31:31.0
Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry Directory | Manufacturer's Representative
Camtech Circuits is ISO9001:2008 and UL certificated. We strictly implement ISO9001 quality management system. Each equipment, every process has its own Manual of Engineering Instructions. No matter p
Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i
