PCB pad repair technique demonstrated using the 2-part epoxy method. More on this PCB pad repair technique: http://www.solder.net/services/pcb-repair/pad-and-trace-repair/ More on the recommended epoxy: http://www.soldertools.net/pcb-repair-epoxy-r
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry Directory | Manufacturer
ALT Dynachem provide the industry with advanced equipments for dry film lamination, both automatic cut sheet laminators and vacuum laminators.
Used SMT Equipment | Board Cleaners
BAY-CHEM is hi-tech Speciality Chemical Formulations Manufacturing Unit established in the year 1996.This is being driven by its own Research & Development wing
Industry News | 2018-09-27 17:08:37.0
Engineered Material Systems, is pleased to introduce the availability of its DF-3505 series dry-film negative photoresists for wafer level metallization processes. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Polyimide tape can either be amber or clear in color, and the film thickness ranges 1 and 3 mils while the adhesive may range from 1 to 2 mils thick. It may be double sided, and the adhesive may be silicone or acrylic based. Anti-static Polyimide t
Industry News | 2016-10-06 09:52:01.0
Engineered Material Systems will exhibit at Semicon Europa, scheduled to take place Oct. 25-27, 2016 in Grenoble, France. Company representatives will showcase both liquid and dry-film negative photoresist for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry film) and processing on MEMS and IC wafers.
