Industry Directory | Manufacturer's Representative
PCB Mfg. & Assembly raw materials- CCL, DryFilm, PISM Ink, Copper Balls, Entry & Back-up board, Insulation material, Solder
Used SMT Equipment | Board Cleaners
Aqueous degreaser cleaner,auto components degreaser,degreaser for ultrasonic cleaning,ultrasonic degreaser,acid corrosion inhibitor,dry film resist stripper
Used SMT Equipment | Board Cleaners
Aqueous degreaser cleaner,auto components degreaser,degreaser for ultrasonic cleaning,ultrasonic degreaser,acid corrosion inhibitor,dry film resist stripper
Used SMT Equipment | Board Cleaners
Aqueous degreaser cleaner,auto components degreaser,degreaser for ultrasonic cleaning,ultrasonic degreaser,acid corrosion inhibitor,dry film resist stripper
Industry Directory | Manufacturer / Manufacturer's Representative
Manufacturer of Polyimide Film and Polyimide Adhesive Tape,Polyimide Sheet,polyimide foam,fpc material,2 layer fccl in china. Yancheng Tiandi Insulation Co.,Ltd Web: https://www.polyimide-pi.com
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
Industry News | 2015-06-17 14:45:34.0
Engineered Material Systems is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Molybdenum, Graphite, PTFE and other fluorocarbon lubricant films applied
Industry Directory | Manufacturer
ZTELEC GROUP, founded in 1958,product including electrical insulation materials, complete transmission and distribution system, enameled wire, 5g electronic communication materials, electrical equipment system, etc
Industry News | 2017-03-20 17:31:31.0
Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
