BEST has a variety of standard circuit frame patterns. We also can cross-reference competitive patterns and fabricate custom patterns without very large minimum orders. Call for help in picking the right circuit frame. These are ALL ROHS compliant. A
Technical Library | 2024-01-08 18:44:00.0
Printed circuit boards, especially multilayer, flexible and rigid-flexible printed circuit boards, are extremely hygroscopic, i.e. they absorb and bind the moisture in the air. A dried polyimide film, for example, will have reached its moisture saturation level again after just a few hours.
Industry Directory | Manufacturer
Manufacturers flexible printed circuits, circuit materials, IC packaging substrates, laminates, conductive coatings and tapes
CGS HN polyimide film has been used successfully in applications at high temperature. It can be laminated, metallized, punched, formed or adhesive coated. CGS has 1mil, 2mil, 3mil, 5mil and 10 mil HN polyimide films. CGSTAPE-7258 (1mil) - 1 mil
Industry News | 2013-10-04 16:50:46.0
Engineered Material Systems Inc will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif.
Industry Directory | Distributor
Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.
Technical Library | 2024-01-08 18:36:01.0
The following aims lie behind the investigations described: The circuit board is an integrated structure made of metal and plastic. Like most integrated components enclosed in plastic, it absorbs water. When it is rapidly heated as, for example, in soldering technology temperature processes, it is a well known fact that the water will evaporate abruptly, leading to destruction. It is therefore essential that the circuit board be dried before these soldering processes. Circuit board manufacturers are extremely hesitant at providing instructions on drying their circuit boards. Information from the ZVEI [1] should also be regarded critically. The cardinal problem is the high temperature which is recommended for baking. If this is applied, the result is often de-lamination and distortion of the circuit boards. Corrosion and the formation of intermetallic phases of the metallic surfaces are also to be expected. The following investigates whether gentle drying at 45°C or 60°C and at low relative humidity achieves the same result as baking at high temperatures. The industry provides novel dry cabinets which are suitable for rapid drying at relative humidities below one percent.
Industry News | 2013-10-29 13:26:58.0
Engineered Material Systems, Inc., is pleased to introduce the DF-3020 Dry Film Negative Photoresist for use in micro-electro-mechanical systems (MEMS).
Industry Directory | Manufacturer
We laminate, die cut and fabricate pressure sensitive tapes, hook and loop materials (3M , Velcro etc.), fasteners, special adhesive films, bumpers and protective products to customer specs and specialize in resolving unusual applications.
Industry News | 2017-04-22 11:52:53.0
Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
