Industry Directory | Manufacturer
Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.
Pyralux® LF Copper-clad Laminate DuPont™ Pyralux® LF has been an industry standard in high reliability applications in the avionics industry for over 30 years and has a proven record of consistency and dependability and is ideal for aerospace and m
Polyimide -Feb tape BJ-CF polyimide film is the general Polyimide film that is coated or laminated on one or both sides with Teflon? FEP fluoropolymer. It imparts heat sealability, provides a moisture barrier, and enhances chemical resistance. App
Industry Directory | Manufacturer
ZHUHAI HIGH-TECH ZONE LENTHEM TECHNOLOGY CO., LTD. located in Zhuhai, A beautiful coast city in Guangdong Province, China. We are specialized in researching & developing, manufacturing, trading DRY CABINET and damp proof wardrobe
Industry Directory | Distributor / Manufacturer
Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.
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The right cable labels for your projects are super important that's why we have the right size cable labels. Printed for free on any laser printer along with free samples. + FREE Software + FREE samples.
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee
The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
