This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal
New Equipment | Board Handling - Storage
Dr. Storage offers the most diverse selection of Dry Cabinets in the industry. The latest Dr. Storage cabinets include cabinets drying at 1% RH, drying at less than 1% RH and baking at 60°C. Cabinets are plug and play so they are up and running easil
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Industry Directory | Distributor / Manufacturer
Electronic Manufactoring Services specialised on transparent conductive Films and on a cold pick & place process.
The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus
Industry Directory | Association / Non-Profit
Independent, non-profit organization of manufacturers and suppliers of photovoltaic (PV) fabrication equipment and related raw
Industry News | 2014-05-05 16:29:24.0
Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).
Used SMT Equipment | Coating and Encapsulation
2018 Ultrasonic Systems Inc. (USI) Model: Prism 400 BT Thin Coat Film Applicator * 220VAC Single Phase Power * Dry Shop Air required. * Exhaust 100 CFM @ .2 In WC *Software Version 4.1.9.0 * Windows 7 O/S * Like new condition - appears ma
Industry News | 2009-04-15 16:24:57.0
WESTMORELAND, N.H. � April 2009 �Polyonics introduces four new materials to help win over new and existing projects.
2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions. A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit
