Technical Library | 2020-11-24 23:01:04.0
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. As a result, the flux outgassing/drying is getting very difficult for devices due to poor venting channel. This resulted in insufficiently dried/burnt-off flux residue. For a properly formulated flux, the remaining flux activity posed no issue in a dried flux residue for no-clean process. However, when venting channel is blocked, not only solvents remain, but also activators could not be burnt off. The presence of solvents allows mobility of active ingredients and the associated corrosion, thus poses a major threat to the reliability. In this work, a new halogen-free no-clean SnAgCu solder paste, 33-76-1, has been developed. This solder paste exhibited SIR value above the IPC spec 100 MΩ without any dendrite formation, even with a wet flux residue on the comb pattern. The wet flux residue was caused by covering the comb pattern with 10 mm × 10 mm glass slide during reflow and SIR testing in order to mimic the poorly vented low standoff components. The paste 33-76-1 also showed very good SMT assembly performance, including voiding of QFN and HIP resistance. The wetting ability of paste 33-76-1 was very good under nitrogen. For air reflow, 33-76-1 still matched paste C which is widely accepted by industry for air reflow process. The above good performance on both non-corrosivity with wet flux residue and robust SMT process can only be accomplished through a breakthrough in flux technology.
Fast-drying, nonflammable defluxer to replace HCFC-141b and other ozone-depleting solvents. Available in aerosols and bulk; money-saving Trigger Grip compatible. This is a very versatile defluxer and light-duty degreaser. Dries almost instantly, no a
Aerosol 1 Gallon Pail 5 Gallon Pail 55 Gallon Drum Economical Because It's Slower-Drying Great On Hardened Flux Residues Evaporates Completely; No Rinsing Required Powerful Remover of Most Glues, Adhesives and Even Tar Trigger Grip� Compatible
New Equipment | Cleaning Agents
IONOX® BC is a general purpose semi-aqueous solvent blend specially designed for effective removal of flux residues and dried uncured adhesives. IONOX® BC is approved for manual stencil cleaning as well as underscreen wipe applications. Manufactur
New Equipment | Cleaning Agents
CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea
New Equipment | Solder Materials
KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu
New Equipment | Cleaning Agents
CYBERSOLV© C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lead free flux
Aerosol 1 gallon Pail 5 gallon Pail 55 gallon Drum Huge Cleaning Power on Fluxes and Pastes Double-Duty as Powerful Degreaser Low Aroma, No Residues Nonflammable Instant Drying
New Equipment | Cleaning Equipment
SMT-stencils, Screens, PCB boards, Various fine pitch stencils Cleaning Process Feed --> Ultrasonic Cleaning --> Spray wash --> Air drying --> Discharge Automatic multiple flux filtering sy
New Equipment | Cleaning Equipment
SMT-stencils, Screens, PCB boards, Various fine pitch stencils Cleaning Process Feed --> Ultrasonic Cleaning --> Spray wash --> Air drying --> Discharge Automatic multiple flux filtering sy
