Electronics Forum: dupont cb-100 (3)

High Aspect Ratio Via Fills

Electronics Forum | Fri Apr 05 11:18:20 EST 2002 | habs24

Anyone have experience using Dupont CB100 for high aspect ratio via fills? Or even where I could get more information on the processes involved? Thanks in advance...

High Aspect Ratio Via Fills

Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef

Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du

Express Newsletter: dupont cb-100 (4)

Partner Websites: dupont cb-100 (21)

/*

Whizz Systems | https://www.whizzsystems.com/wp-content/plugins/ct-view-360/assets/js/jquery.reel.js?ver=6.0.5

(W,g.stitched),l=!p.length||m;l=e(Ya,g.responsive&&(Fc?true:!l));var q=e(fc,{}),u=g.loops,v=g.orbital, E=g.revolution,ba=g.rows,ca=e(sa,Ga(g.footage,g.frames));e(Za,g.spacing);var Cb=e(D,+h.attr(D)||h.width()),Db=e(L,+h.attr(L)||h.height()),Gc=e(Ja

Whizz Systems


dupont cb-100 searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t net
  1 2 3 Next
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"
See Your 2024 IPC Certification Training Schedule for Eptac

World's Best Reflow Oven Customizable for Unique Applications
Baja Bid Auction JUL 9-10, 2024

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
2024 Eptac IPC Certification Training Schedule

Component Placement 101 Training Course
Electronic Solutions R3

Thermal Transfer Materials.