Product Description Noves ESD insulation materials are made by fiberglass & epoxy resin with high-temperature and high-pressure forming, They are a kind of engineering plastic sheet, They are as same as Durostone, Ricocel, and CDM material. Have bee
Hold down clamps for solder pallet and SMT fixture in PCB Assembly. Specifications 1.Hight temperature resistent. 2.Position PCB substrate to avoid from floating I.Features 1)Designed specifically for use in wave solder operations 2)Mostly made fr
Wave soldering machine infeed conveyor Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg Product description: SMT Assembly line Wave soldering machine infeed conveyor Wave soldering machine in
Wave soldering machine infeed conveyor Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg Product description: SMT Assembly line Wave soldering machine infeed conveyor INQUIRY Wave sol
New Equipment | Industrial Automation
Wave soldering machine infeed conveyor Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg INQUIRY Wave soldering machine infeed conveyor Specifications: 1. It is used to feed PCB’s or pallets
New Equipment | Board Handling - Conveyors
Wave soldering machine infeed conveyor Demensions:1000*700*750(mm) PCB width:0-350(mm) Conveyor speed:0-2000(mm)/Min Weight:Approx.45Kg Product description: Wave soldering machine infeed conveyor, Demensions: 1000*700*750(mm), PCB width:0-350(
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New Equipment | Board Handling - Pallets,Carriers,Fixtures
Hold down clamps for wave solder pallet Hight temperature resistent: 200degree, max 280degree (10~20s) Included items of a set: a screw, a spring, a plastic part and a sleeve(some models) Used to be positioned PCB substrate in wave solder carriers
Description Durostone is a fiber-reinforced plastic for mechanical and electrical applications. With good performance against electric arc and tracking, it is an ideal material for solder paste printing, SMT process, reflow soldering and wave solderi
Technical Library | 2023-11-14 19:24:08.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
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