Industry News | 2009-02-11 14:04:14.0
ITASCA, IL � February 2009 � Kester announces 110 years in business as a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets.
Industry News | 2009-01-09 11:10:24.0
Systronix, Inc. Adds New Equipment and Processes
Industry News | 2006-09-20 11:32:52.0
September 20, 2006
Industry News | 2018-10-25 15:34:22.0
Juki Automation Systems today announced that Horizon Sales now represents the company in Florida. Horizon already manages and sells Juki equipment to the mid-western states of: Michigan, Ohio, Indiana, Kentucky, Western Pennsylvania, Illinois, Eastern Iowa and Wisconsin, and has now expanded into Florida.
Industry News | 2011-02-09 14:43:39.0
If up to now a separate dispenser had to be deployed to set glue dots or to add additional solder paste to a board assembly, it is now possible to use this function within the stencil printer itself.
Industry News | 2023-07-19 09:57:24.0
Groundbreaking for new production in Ciudad Juárez Chihuahua
Industry News | 2020-06-11 06:23:00.0
Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.
Industry News | 2011-09-19 13:33:11.0
Viscom AG is now working with SILGAL IBERICA S.L. as its new representative for the entire Iberian peninsula. SILGAL will represent Viscom throughout Spain and Portugal.
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2017-04-11 21:21:11.0
KYZEN today announced plans to participate in the Contamination, Cleaning & Coating Conference, scheduled to take place May 22-24, 2017 in Amsterdam. The event is co-organized by SMTA and SMART Group. Mike Bixenman, DBA, KYZEN Corporation will present “Development of a Risk Profile from Flux Residues Trapped under Leadless Components” in Session I entitled “Residues Trapped under Component Terminations”. All presentations in this session will address a common question faced by OEMs when designing electronic hardware: How clean is clean enough?
