Electronics Forum | Wed Oct 23 15:50:31 EDT 2002 | bdoyle
Hi Terry, You can post the article in the library component on the site. If you also send it to me via email (bpdoyle@smtnet.com) I'll look it over for next month's express.
Electronics Forum | Thu Oct 24 11:19:31 EDT 2002 | nifhail
thanx Randy.. But Terry how can I get the chnace to look at the paper that you are going to publish. thank you.
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Thu Aug 14 17:37:11 EDT 2008 | bandjwet
Dear Smtnettter: Has anyone purchased yellow visible colored dye penetrant for dye and pry testing? Can someone recommend a vendor? BTW this was recommend to me by an end user in japan as some copper problems are "hidden" by the typical red visible
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca
Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint
Electronics Forum | Tue Sep 25 23:09:23 EDT 2018 | franknguyen
Hi, We are PCBA production company which factory's located in Vietnam. Somtime, we have to analyse failure of product to find out the root cause (ex: Micro-crack of solder joint under BGA IC...). We are searching labs around Asia (Vietnam, Malaysia,
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