Electronics Forum | Wed Oct 23 15:00:21 EDT 2002 | Terry Burnette
Dave, we're about to publish a paper in Advanced Packaging mag. on the use of dye penetrant testing. Educate me on how to enclose the paper on this web site and I'll be glad to let everyone review it.
Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Wed Oct 23 15:50:31 EDT 2002 | bdoyle
Hi Terry, You can post the article in the library component on the site. If you also send it to me via email (bpdoyle@smtnet.com) I'll look it over for next month's express.
Electronics Forum | Thu Oct 24 11:19:31 EDT 2002 | nifhail
thanx Randy.. But Terry how can I get the chnace to look at the paper that you are going to publish. thank you.
Electronics Forum | Wed Jan 26 09:27:41 EST 2005 | davef
Look here for more on dye & pry: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25007
Electronics Forum | Sat Apr 02 07:26:47 EST 2005 | davef
It's used for BGA 'disassembly'. Look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=32271
Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq
All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean
