Industry News | 2017-03-01 14:41:48.0
ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
Industry News | 2016-04-07 10:40:38.0
At last month’s APEX event in Las Vegas, ECD was honored with one of the electronics assembly industry’s most prestigious awards, the Service Excellence Award. Unlike other contests that are voted on by a judging panel, the Service Excellence Award has particular cachet because winners are determined based on direct responses from participants’ customers, the true authorities of a company’s performance.
Used SMT Equipment | Soldering - Reflow
2009 Vitronics XPM2 Reflow Oven has Left to Right. 8 heating zones and 2 cooling zones. Only in use 6 months. 208V, 3 Phase, 60 Hz. System: * 8 top and bottom forced convection heat cells and 2 top and bottom cooling cells * Overall syst
Industry News | 2001-08-02 13:39:10.0
ECD has announced that its new Guide to Quality Control of the Automated Solder Process is now available. This 16 page Guide will provide users with important information about Classic PCB Temperature Profiling as well as how to maintain a wave or reflow solder machine in "factory-new" condition.
This wizard guides a user through the communications setup process so the software and M.O.L.E. can communicate. Categories: OvenRIDER, OvenRIDER SPC (v5.2x)
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Painless Profiling for Perfect Oven Recipes When utilizing the AutoM.O.L.E.®Xpert3 System, you are entering a new phase in the thermal management of your automated soldering operations. The new AutoM.O.L.E.®Xpert3 System automatically guides you thr
Do you demand the highest density of thermocouples placement possible on your Hi-Reliability, High-Value PCB? ECD's got your Spec! Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of yo
