Technical Library | 2019-05-30 10:59:13.0
In the current economic environment, the ability to reuse ball grid array(BGA) components that have failed due to solder defects may be an efficient way for electronics manufacturers to reduce costs. Cost may not be the only driving factor in the decision to engage in this recycling practice. The increasing demands placed upon the complexity of microprocessors and integrated circuits (ICs) has decreased the availability of some components, and increased their lead time. Because of this, reballing may provide a means to meet schedule, reduce rework turn-around time, and give a manufacturer a decisive advantage over other companies in an ever increasingly competitive market. This article will discuss the process of reballing BGA components (Figure 1), examining preparation (the preform method, the screen method), and cleaning and bake-out.
Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
FKN Systek K1000 - Economical Manual and Motorized Depaneling of Pre-scored PCBs Blades Made of Long Lasting High Speed Steel.. Singulate Panels with Components up to 2.5" Adjustable front blade guard for correct scoreline input. Optional Work
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Consider the options-How should I mask for Conformal Coating?
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Semicon West
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Arizona/Sonora Chapter Meeting: Electronic Component Market Update
The FKN Systek S100 is an economical PCB singulating saw for moderate production volumes and laboratory use. The diamond saw blade with the linear bearing positioning table to guide the PCB to be cut, allows for quick and clean singulation of PCB
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IPC releases October 2023 Economic Outlook Report
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
