Industry Directory | Manufacturer
Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.
Industry Directory | Manufacturer
Alltemated sets the standard for tape and reel packaging, IC programming, lead trim/forming, bake and dry-pack services and carrier tape manufacturing.
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
New Equipment | Rework & Repair Equipment
The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus
Electronics Forum | Thu Dec 13 10:30:42 EST 2007 | slthomas
I would never have guessed that McM-Carr would carry that stuff (antistatic belts) but you learn something new every day....thanks! Question, though. Their online catalog says to order by the inch of circumference (OC, or outer circle), implying tha
Electronics Forum | Fri Oct 02 11:59:37 EDT 1998 | jon Medernach
| I am experiencing solder paste comtaminatin of nozzels on 0603 size components resulting in missing components. The machine is failing to alarm under these circumstances. Has anybody else experienced this problem & found a solution? | Just a sugge
Used SMT Equipment | Soldering - Selective
Hot Bar Soldering Flex Circuit to PCB Ribbon Cable to PCB Coaxial Cables Fine Pitch SM Devices Edge Connectors to PCB Thermocompression Bonding Tab to PCB, HSC to LCD or tab More information pjbril@smtunion.com m.madera@smtunion.com W
Used SMT Equipment | Pick and Place/Feeders
SIEMENS S20 Chip Shooter D.O.M.:1998 S/N:876-9696 Nozzel Changer L-R single Conveyor; rated at 20;000 cph; two gantry's; twin 12 star heads; Includes two trolly's. Location:Atlanta; GA Machine being auctioned off May 15th - 17th at the following li
Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2007-10-04 17:21:57.0
SARASOTA, FL � September 27, 2007 � Inovaxe Corp., a leader in delivering supply chain management solutions to electronics manufacturers, announces that it will exhibit both a one- and a two-bay INOCART material handling system (INOCART-2BAY) in booth 618 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Parts & Supplies | SMD Placement Machines
0102004 ROLLER 0104008 Bracket 0104009 shaft 0104018 block 0105001 shaft 0101111 PIN 0102102 PIN 0103012 SPRING 0105003 plate 0105004 spring 0105005 plate 0105008 Tube Canvil 0109035 STOPPER 0109036 STOPPER 0101020 WASHER 0101008 PIN 00420056 PIN 010
Technical Library | 2010-03-30 21:51:23.0
This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
PCB pad repair technique demonstrated using the 2-part epoxy method. More on this PCB pad repair technique: http://www.solder.net/services/pcb-repair/pad-and-trace-repair/ More on the recommended epoxy: http://www.soldertools.net/pcb-repair-epoxy-r
Events Calendar | Wed Aug 21 00:00:00 EDT 2024 - Wed Aug 21 00:00:00 EDT 2024 | Kaohsiung City, Taiwan
Taiwan Alliance LTS Workshop
Events Calendar | Tue Sep 10 00:00:00 EDT 2019 - Thu Sep 12 00:00:00 EDT 2019 | Novi, Michigan USA
Battery Show
Career Center | Melbourne, Florida USA | Engineering,Production,Quality Control
Engineering Specialist - Advanced Manufacturing Technology organization Palm Bay, Florida � GCSD01041082 Job Description: Work in the Advanced Manufacturing Technology organization on the development, qualification, and implementation of leading-edg
Career Center | Melbourne, Florida USA | Engineering,Research and Development
Harris Corporation (NYSE-HRS) is an international communications equipment company focused on providing product, system, and service solutions that take its customers to the next level. The company provides wireless, broadcast, government, and networ
Career Center | bangalore, India | Management
• Hands on experience in planning functions i.e. material planning, scheduling, inventory management. • We have a good knowledge of BOM, KANBAN, MIN-MAX order quantity, • We have Good knowledge in ERP Baan System , • Demand adjustment as per cu
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
. For beam lead devices: (d-1) Silicon broken. (d-2) Beam lifting on silicon. (d-3) Beam broken at bond. (d-4) Beam broken at edge of silicon. (d-5
GPD Global | https://www.gpd-global.com/co_website/video-apps.php
. Dispensing and UV Curing within the same System. Wafer Processing Dispensing Adhesive Seal (MEMS) on Wafer with Precision Auger Pump. Dispensing Edge Seal on Wafer with Volumetric PCD Pump
