Parts & Supplies | Component Packaging
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Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
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Industry News | 2023-10-02 10:05:09.0
IPC continues to collaborate with the electronics manufacturing industry to meet their current and future workforce training needs. This collaboration includes expanding its course offerings to include self-paced courses on soldering, inspection, and manufacturing engineering. With the introduction of eight new training courses in 2023, IPC reaffirms its commitment to ensuring that professionals in electronics manufacturing remain at the forefront of the industry.
Industry News | 2016-07-05 17:46:03.0
IPC is introducing three new quarterly subscription reports. These exclusive reports provide electronics manufacturers a competitive edge that comes from having solid, timely and reliable market research data.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2010-06-16 14:00:47.0
Minneapolis, MN - The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Walt Disney World Swan and Dolphin Resort in Orlando, Florida on October 24-28, 2010. This year's program allows the attendee to choose from 20 courses, 130 technical papers, 4 focused symposia, and numerous free offerings throughout the conference.
