Full Site - : edge delamination from depanel (Page 12 of 14)

Questions About Risk of PCB Delamination as a Result of Moisture Build Up After Damage to Solder Mask

Electronics Forum | Tue Apr 23 10:31:59 EDT 2019 | laserpro

Hi all and thanks for viewing my post! My questions related to the subject line are as follows: 1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask? 2. Does exposed FR4 na

Damaged PCB.. what do you think?

Electronics Forum | Fri Mar 16 10:04:41 EDT 2012 | davef

We'd repair a drop board like this. Here's what our old friend Jeff Ferry said is a published article ... When boards lose their edge: when the corner of a circuit board breaks or is damaged, the problem cannot be ignored by Jeff Ferry One of the m

Re: Beat rate

Electronics Forum | Sat Feb 05 05:10:53 EST 2000 | Dean

It would be helpful to have some additional info on your line and process. Lets make some assumptions... Consider: re-tooling costs for your fab supplier. Can your supplier hold the additional tollerences for a larger panel. Can your supplier fab

0201 caps

Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew

I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s

V-scoring vs. Tab-Routing

Electronics Forum | Tue Jun 03 16:05:58 EDT 2003 | mk

Hi Randy, From a bare board manufacturers stand point, scoring is probably faster and easier but has limitations. If your boards are square or rectangle scoring will work fine. Once assembled the scored grooves can be sliced apart using what is some

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

board delaminated after reflow

Electronics Forum | Wed Apr 08 14:46:34 EDT 2009 | boardhouse

The things to ask your board supplier would be: 1) Was the Pre-preg material that was used on this board within its Shelf life? and ask for the Incoming inspection CofC for the Pre-preg material. 2)Was this order shipped from Stock - this is why

0201 caps

Electronics Forum | Tue Dec 03 20:54:57 EST 2002 | davef

Q1:A picture of the sectioned MLCC would be nice. A1: I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. R1: You�re correct. You cannot post pix on SMTnet. Please email me t

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies


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