Industry News | 2008-05-12 18:34:19.0
The SCBL-77 (Vertical Buffer) is a premium solution for controlling line flow. The system provides 15 slots (stacked edge belts) each at positioned at 30 mm spacing. The station can operate as a LIFO, FIFO or PASS conveyor and is controlled by a precise servo-driven controller.
This conveyor allows for operators to sift through and pull PCB's off the assembly line to inspect and handle for whatever reason they may need. • SMEMA Interface • Operator work space at the front • LED lighting • Work an
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Career Center | San Jose, California | Engineering,Management
Director of Hardware Engineering & Systems Engineering This is a cutting edge opportunity to bring your current or very recent experience from a leading OEM such as Dell, HP/Compaq, Apple, or other leading PC, Notebook, and Storage and Server manufa
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
New Equipment | Solder Paste Stencils
Tropical Stencil’s Laser Cut SMT Stencils are produced utilizing high speed lasers to produce the smoothest aperture wall possible. Far superior to chemically etched stencils, and with emerging new materials, stencils are produced using “fine grain”
New Equipment | Fabrication Services
PentaLogix offers three PCB fabrication services: US QuickTurn Prototype PCB Includes full Smart DFM design check US made high-quality circuit boards FAST turn times: 2-layer in 1-2 days, 4-6 layer in 2-4 days Tin lead HASL or OSP RoH
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
Space saving fully-automatic laser depaneling system. The DIVISIO Laser 3000 Compact is a space saving fully-automatic laser depaneling system for high production volumes. State of the art laser technology and a precise galvo-head enable high-speed
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