Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2021-09-17 04:23:02.0
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Empire Expo & Tech Forum on Tuesday, September 28that the RIT Inn & Conference Center in Henrietta, New York.
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
Industry News | 2021-02-25 13:41:10.0
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
Industry News | 2021-12-21 14:42:52.0
The Kester brand of MacDermid Alpha Electronics Solutions is proud to announce a partnership with Proactive Process Solutions Group, LLC.
Industry News | 2022-03-03 16:02:24.0
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.
Industry News | 2022-03-09 12:21:01.0
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.
Industry News | 2022-05-05 17:38:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing will discuss solutions for voiding at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
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