Industry News | 2020-02-06 07:13:51.0
Seika Machinery, Inc. announced its sales awards during its annual sales representative training meeting on Tuesday, February 4, 2020 during the IPC APEX EXPO.
Industry News | 2010-08-27 14:01:15.0
Job Shop Company CEO Ben Edwards produced his first contract manufacturing tradeshow in nearby Paramus, N.J., in 1975. Thirty-five years later, the Greater New York Design-2-Part Show proudly supports his vision of sourcing parts and components that are “Made in America.”
Technical Library | 2012-11-01 20:54:49.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The continuous progression toward portable, high frequency microelectronic systems has placed high demands on material performance, notably low dielectric constants (Dk), low loss tangent (Df), low moisture uptake, and good thermal stability. Epoxy resins are the workhorses of the electronic industry. Significant performance enhancements have been obtained through the use of PPE telechelic macromonomers with epoxy resins. However, there is a ceiling on the performance obtainable from epoxy-based resins. Therefore, non-epoxy based dielectric materials are used to fulfill the need for higher performance.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
Industry News | 2017-05-18 20:07:59.0
KYZEN plans to exhibit at the Toronto SMTA Expo & Tech Forum held in conjunction with the International Conference on Soldering & Reliability (ICSR). The event is scheduled to take place Wednesday, June 7, 2017 at the Edward Village Markham in Ontario. KYZEN’s team will discuss the KYZEN ANALYST™ Real-Time Concentration Monitoring & Reporting System.
Industry News | 2019-04-23 07:52:35.0
BTU International is pleased to announce that JW Corporation will represent the company in Canada. Owner and President of JW Corp. Jason Wahba recently expanded his territory to cover all of Ontario along with Quebec, New Brunswick, Nova Scotia, Prince Edward Island and Newfoundland, Canada.
Industry News | 2017-05-22 17:36:43.0
KYZEN is pleased to announce that Mike Bixenman, DBA will present at the International Conference on Soldering & Reliability (ICSR) held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled, “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach” at 2:30 p.m. on Wednesday, June 7, 2017 at the Edward Village Markham in Ontario.
Industry News | 2018-04-30 15:51:18.0
PDR is pleased to announce that it has partnered with PDMTECH Services as its manufacturers’ representative in the Eastern Canada territory. Based in Long Sault, ON, Paul Morin will represent PDR’s IR rework systems in Ontario, Quebec, New Brunswick, Newfoundland, Nova Scotia and Prince Edward Isl.
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
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