Electronics Forum | Thu Jan 14 22:35:08 EST 1999 | Chris G.
| | I'm looking for a CABGA test socket for a 2 CABGAs. One 81 ball CABGA is 9mm x 9mm with .46 mm dia balls on .8mm pitch. The other is a 64 ball CABGA 8mm x 8mm with .46 mm dia balls on .8mm pitch. I need to pretest CABGAs before placement due t
Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne
Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
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