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Dip and Look Systems - Pulsar Solderability System

Dip and Look Systems - Pulsar Solderability System

New Equipment | Test Equipment

“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations.  After the dip process, the operator inspects the terminatio

Hentec Industries, Inc. (RPS Automation)

EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into existing

EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into existing

Videos

EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis

HARWIN

SMT PCB Hardware from Harwin - simplify EMC shielding, cable managment and test

SMT PCB Hardware from Harwin - simplify EMC shielding, cable managment and test

Videos

EZ-BoardWare is a range of SMT PCB Hardware from Harwin that allows simplified EMC shielding, improves cable management and solves tricky PCB layout issues. Packaged in EIA-481-2 compliant tape & reel packaging the products integrate simply into exis

HARWIN

Koh Young Returns to Semicon West with New Inspection Solutions Designed for Semiconductor and Advanced Packaging Challenges

Industry News | 2023-06-12 20:40:57.0

Atlanta, GA ā€“ Koh Young, the industry leader in True3Dā„¢ measurement-based inspection solutions, is pleased to announce its return to SEMICON West with a new series of inspection solutions designed to increase advanced package and semiconductor yield. Several of our latest inspection machines will be on display during SEMCION West in booth 329 from 11-13 July 2023 in the Moscone Center, San Francisco, CA.

Koh Young America, Inc.

Tape and Reel Flatness?

Electronics Forum | Mon Nov 26 16:07:56 EST 2012 | jerlong

Greetings, Does anyone know where to find a tape and reel flatness specification? Looking at the EIA 481-B standard, there is no reference to the tape flatness (the images shown may "imply" flatness from one side of the tape to the other, However I

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

Re: PCB and component handling guidelines

Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina

I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/

Re: PCB and component handling guidelines

Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina

I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/

Stepmotor and sprocket for advancing Carrier Tape

Electronics Forum | Wed Apr 15 11:03:59 EDT 1998 | Haim Halpert

We are looking for some basic mechanical parts to advance parts in the Tape & Reel Carrier Tape using a stepmotor. The Carrier Tape we use is as per the EIA Standards and I imagine there are dozens of companies that make a sprocket gear to handle t


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