Industry News | 2011-01-18 13:20:51.0
Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.
Industry News | 2010-06-04 00:21:31.0
Minneapolis, MN - The SMTA proudly announces the fall offerings of SMT Processes and Six Sigma/Green Belt Certification in San Jose and Orlando. The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Industry News | 2009-01-30 19:24:53.0
Minneapolis, MN � The SMTA proudly announces nine offerings of Processes and Six Sigma/Greenbelt Certification scheduled for 2009. The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level. The 2009 offerings span the US and are also offered internationally in Canada and China.
Industry News | 2016-03-08 16:30:22.0
The SMTA proudly announces upcoming offerings of SMT Processes and Six Sigma Green Belt Certification. The SMTA Certification program is unique as it recognizes and certifies the entire SMT assembly process at an engineering level.
Industry News | 2003-04-21 09:11:21.0
One for SMT Processes and one for SMT Systems
Industry News | 2010-10-30 02:09:14.0
The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.
Technical Library | 2020-04-01 14:24:56.0
It happens much too often; manufacturing engineers are brought into a NEW product design phase at the very end of a design and are asked to provide input that should have been provided much earlier. One needs to understand how the circuit board design and quality of the manufacturing process not only effects assembly yield and product reliability, but how it could also affect the results of any testing that is done to circuit packs during prototyping. It is important that any circuit pack (including prototypes) that will be used in reliability, performance and functional testing be designed with the proper features and assembled with a manufacturing process that has been developed to produce a high-quality assembly. If not, the results of any testing might not represent the actual characteristics of the design and provide miss-guidance to future changes.
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
Industry News | 2010-12-07 14:47:59.0
Following European Parliament agreement of the final text of the new RoHS Directive on November 24, ENVIRON and IPC— Association Connecting Electronics Industries® present an exclusive webinar to provide essential information on the new compliance requirements for manufacturers, importers and distributors. The RoHS Directive Recast Webinar will be held Thursday, December 16, 10:00 am to 11:00 am U.S. Central time (4:00 pm to 5:00 pm Central European time).
Industry News | 2010-11-18 11:21:04.0
IPC has released the training and certification programs for revision E of IPC-A-610, Acceptability of Electronics Assemblies, and J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies.
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