Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
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Other courses related to electronics manufacturing and assembly
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
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Parts & Supplies | Pick and Place/Feeders
MCA0051 FUJI CP6 8X4 Feeder Beak Model: Fuji FUJI Mounter Specifications: CP6 8X4 FEEDER Part Number: MCA0051 Name: CP6 8X4 FEEDER A large number of FUJI placement machines feeder press cover clearance prices for sale: 2MDLFA033900 FUJI NXTIII
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Used SMT Equipment | Soldering - Reflow
Production Overview:The 1505 MK5 from Heller Industries Inc is a Reflow Soldering Equipment with Heating Zone Length 200 mm. More details for 1505 MK5 can be seen below. With its features increases productivity, this 5 zone reflow oven improves quali
ETA High Reliability Special Hot Air Reflow Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special
