High-end Reflow Soldering Machine Good Price ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional over
High-end Lead Free Solder Reflow Oven ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional oversea ser
High-end LED Reflow Soldering Machine ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional oversea serv
Industry Directory | Manufacturer / Other
BGA Reballing Services - PBGA, TBGA, CBGA, and CSP reballing services as low as 0.02 cents/individual solder ball attachment. We provide solder column attachment, & tinning, by means of Hot Solder Dipping, for Electrical Components.
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
Career Center | Melbourne, Florida USA | Engineering,Production
Mechanical Engineer Candidate will work in the Advanced Manufacturing Technology organization executing the development, qualification, and implementation of leading-edge manufacturing processes across a broad range of applications and support manufa
Used SMT Equipment | Conveyors
PROMATION SPRING INVENTORY CLEARANCE TRADE SHOW UNITS Model: ESL and ESU- 700 SL MULTIPLE MAGAZINE LINE LOADER & UNLOADER SET Configuration: In-Line Configuration with in-line buffer (1730 mm L x 870 mm D) Frame Style: Pr
Used SMT Equipment | Pick and Place/Feeders
Mydata MY12 placement machine (68) Model: MY12 Year: 2004 S/N: 13369 Hydra Head and Midas head Agilis Compatible TPSys by MYDATA Automation version 2.4.5d (2.4+) for Linux Voltage: 3 x 210/121 V AC, 50/60 Hz Power: 3 x 2.2 kVA CE Marked I
Used SMT Equipment | Pick and Place/Feeders
Mydata MY12 placement machine (84) Model: MY12 Year: 2004 S/N: 13368 Hydra Head and Midas head Agilis Compatible TPSys by MYDATA Automation version 2.4.5d (2.4+) for Linux Voltage: 3 x 210/121 V AC, 50/60 Hz Power: 3 x 2.2 kVA Installed Op
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
