Technical Library | 2016-07-28 17:00:20.0
Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
Technical Library | 2020-11-04 17:57:41.0
Residues present on circuit boards can cause leakage currents if not controlled and monitored. How "Clean is Clean" is neither easy nor cheap to determine. Most OEMs use analytical methods to assess the risk of harmful residues. The levels that can be associated with clean or dirty are typically determined based on the exposed environment where the part will be deployed. What is acceptably clean for one segment of the industry may be unacceptable for more demanding segments. As circuit assemblies increase in density, understanding cleanliness data becomes more challenging. The risk of premature failure or improper function is typically site specific. The problem is that most do not know how to measure or define cleanliness nor can they recognize process problems related to residues. A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow settings and cleaning methods. High impedance measurements are performed on break off coupons designed with components geometries used to build the assembly. The test method provides a gauge of potential contamination sources coming from the assembly process that can contribute to electrochemical migration.
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
Industry News | 2017-08-29 15:45:56.0
KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International. The SMTA International Technical Conference is scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.
Industry News | 2020-01-16 16:26:16.0
CyberOptics® Corporation will exhibit at SEMICON Korea from February 5-7th, 2020 at the COEX in Seoul, booth #C236. During the show, the company will unveil and demonstrate its new WaferSense® Auto Resistance Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics.
Industry News | 2020-09-17 11:48:34.0
MAGNALYTIX® today announced its participation in the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 where you will have access to chat live with a MAGNALYTIX team member and the On-Demand Conference & Expo will take place Sept. 28-Oct 23, 2020. The MAGNALYTIX team will present three papers during the On-Demand Conference.
Industry News | 2020-11-27 02:44:38.0
Ultrasonic Spray For Electrode Coating. Maximizing the use of Electrode in the Fuel Cell by ultrasonic spray
Industry News | 2021-12-10 20:25:59.0
The gas sensor is used to detect specific gases in a certain area and continuously measure the concentration of gases as well. In the areas of coal, petroleum, chemical, municipal, medical, transportation, family and other safety protection, gas sensors are often used to detect the concentration or presence of gases that are flammable, toxic, or their oxygen consumption. Gas sensors are often indispensable in safety systems thanks to the detection of gases around.
Industry News | 2003-02-28 08:22:47.0
Dr. Zhang will lead the global R&D and product formulation activities of the company's tin, tin alloy and lead-free technologies.
