Industry News | 2013-04-01 09:02:49.0
AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA
Industry News | 2013-04-08 19:29:43.0
AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2013-05-13 15:06:06.0
AIM Solder, announces that NC277 is a VOC-free liquid flux that is as electrically safe as an alcohol-based flux and has a medium residue that is suitable for long thermal demands. Winner of a 2013 NPI Award from Circuits Assembly, this halide-free, environmentally safe liquid flux has upon introduction been recognized for exceeding industry standards.
Industry News | 2013-05-07 13:45:19.0
AIM Solder announces that NC259 Solder Paste is a low-cost, lead-free and halogen-free solder paste that offers superior performance comparable to that of tin/lead and high-silver lead-free solder pastes, a virtual drop-in for costly SAC305.
Industry News | 2011-04-20 20:31:30.0
FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.
Industry News | 2009-04-08 15:48:25.0
DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials and Dow Corning's Distributor of the Year, announces that it will exhibit technologies from its industry-leading suppliers in booth 1141at the upcoming NEPCON East Exhibition and Conference, scheduled to take place April 22-23, 2009 at the Boston Convention & Exhibition Center in Boston, MA.
Industry News | 2011-11-01 19:36:58.0
Krayden has received an Outstanding Teamwork 2011 Award from Henkel Technologies. The award reiterates Krayden’s ongoing dedication to world-class customer services.
Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Wed Jun 25 12:13:31 EDT 2003 | russ
A lot of it depends upon what the lead terminations are and the storage conditions. For example if they are tin you will run into trouble. We have used all types of parts that are all ages (We just started doing BGAs that are 5 years old.) I don't
Electronics Forum | Wed Jul 29 13:44:45 EDT 1998 | David Spilker
We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone had
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