Electronics Forum | Thu Mar 06 09:25:13 EST 2014 | davef
Stencil, Electroformed * AGI, 177 Nick Fitcheard Rd, Huntsville, AL 35806; 256-858-3300 F256-858-3304 agicorp.com * ALPHA® Form™ alpha.alent.com * Chepaume Industries, 6001 Airport Road, Oriskany, New York 13424; 315-768-7001 F315-768-0270 info@chepa
Electronics Forum | Wed Jul 15 12:22:57 EDT 1998 | Steve Moore
Electropolishing definitely improves the print characteristics of both Laser-cut and Chem-etch stencils. The caveat here is avoid over polishing which results in rounding of the edges and/or enlargement of the openings. Over polishing is typically th
Electronics Forum | Thu May 17 11:07:11 EDT 2012 | scottp
I don't have an opinion on nano coatings since I haven't tried them. Our suppliers keep pushing it so I'll eventually check it out. The reason I zeroed in on the FG foil is because I almost fell into that trap. Several years ago I wasn't aware the
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp
Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c
Electronics Forum | Mon Aug 23 10:11:55 EDT 2010 | flipit
Hi, I have never been able to find an acceptable dispense process for dispensing small dots of solder paste. I currently have an auger screw automated dispense system and can not accomplish 0.010" dot sizes. In addition, stencil printing is much m
Electronics Forum | Wed Jul 01 03:05:56 EDT 1998 | Jon Gruett
| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
Electronics Forum | Sat Aug 14 07:01:44 EDT 1999 | Earl Moon
| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I know we all seek easy/better solut
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
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