Industry Directory | Manufacturer
Manufacturer of Laser cut stencils, thick film screens, large format screens. Variety of stainless steel materials and mesh, ITAR registered. Member of SMTA, IMAPS and IPC.
New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
New Equipment | Solder Materials
Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils and related products in the industry. Fine Line Stencils highly-polished PrintMaster and Slic-Blade nickel squeegee blades offer impro
Industry News | 2015-12-13 20:24:18.0
Photo Stencil announces that it has sold the Photo Stencil business in Guadalajara, Mexico to the facility's management team, Francisco Lujano and Armando Berumen. Photo Stencil's Mexico facility produces laser-cut stencils and will continue to sell both the laser-cut stencils they manufacture and electroform stencils that will be made by Photo Stencil in its new Golden, CO facility.
Industry News | 2013-09-30 18:14:34.0
Free Session, Spotlight 4, October 16, 2013 from 9:30-11:00 AM
Technical Library | 2011-12-08 17:46:42.0
The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c
Industry News | 2008-11-18 17:09:27.0
COLORADO SPRINGS, CO � November 17, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces proven performance gains with its new Slic� stencil material. Introduced in January 2008, FINE LINE STENCIL's new Slic� stencil material has made a dramatic impact on the stencil market.
Industry Directory | Manufacturer
AGI is an Internationally known supplier of PCB Assembly Tooling. AGI manufactures wave solder pallets, SMT Fixtures, Kitting Carts and etc... for PCB Assembly. Let us help you with your tooling need
Technical Library | 2012-10-25 16:34:02.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated.
Technical Library | 2023-07-25 16:25:56.0
This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high- performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um-40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package.
